Why Work at Lenovo

We are Lenovo. We do what we say. We own what we do. We WOW our customers.

Lenovo is a US$57 billion revenue global technology powerhouse, ranked #248 in the Fortune Global 500, and serving millions of customers every day in 180 markets. Focused on a bold vision to deliver Smarter Technology for All, Lenovo has built on its success as the world's largest PC company with a full-stack portfolio of AI-enabled, AI-ready, and AI-optimized devices (PCs, workstations, smartphones, tablets), infrastructure (server, storage, edge, high performance computing and software defined infrastructure), software, solutions, and services. Lenovo's continued investment in world-changing innovation is building a more equitable, trustworthy, and smarter future for everyone, everywhere. Lenovo is listed on the Hong Kong stock exchange under Lenovo Group Limited (HKSE: 992) (ADR: LNVGY).

• Lead the organization's knowledge and expertise on the latest memory technologies and trends, propose technical roadmap.
• Work closely with industry leaders (platform / memory) and performance team to advise on system architecture design from memory and memory subsystem perspectives.
• Drive common portfolio level memory subsystem architecture and provide deep expertise on memory RAS feature planning and implementation from controller, memory supplier and platform design perspective.
• Work with a team of other distinguished experts in firmware, I/O, power, thermal, etc. to lead the memory subsystem architecture and design, and to conduct research and lead proof of concept for future memory subsystem technologies.
• Troubleshoot memory failures reported by the CSP team members on the different test processes along with memory supplier and customer design perspective.
• Conduct failure analysis and implement corrective actions to ensure product quality.
• Document best practices and lessons learned to improve product quality and test efficiency.

• BS in engineering required.
• 6+ years of work experience with hands-on on volatile memory related development.
• Experience with memory topologies ranging from single socket servers up to 8 socket servers.

• A Master's degree in Computer or Electrical Engineering is a plus.
• Hyperscale/Cloud experience
• Can use oscilloscopes, protocol analyzers, host bus adapters, meters, and other test equipment to debug HW/SW/FW issues.
• Knowledge and experience with memory topologies ranging from single socket servers up to 8 socket servers.
• Deep understanding of error correction algorithms and memory controller design at the RTL level
• Knowledge and experience with statistical analysis of DIMM failure rates / modes
• Participation in JEDEC and future memory technologies
• Deep understanding of alternate memory interconnects and architectures such as CXL, memory centric compute, memory tiering, advanced caching enablement.
• Experience innovating and working with software and firmware enablement of advanced memory RAS, Pre-failure Monitoring, ACPI, NUMA awareness and optimization approaches.
• Experience in direct customer engagements and the ability to interface with Lenovo and customer executives.
• Ability to understand customer requirements; interpret these requirements and convert them into a competitive CSP platform portfolio.
• Proficiency with Linux server operating systems
• Willingness to travel domestically and internationally.
• Ability to work effectively cross-culturally across teams in the USA, Asia and Mexico