Introduction
IBM Research is seeking intern candidates who want to apply their classroom learning's to real world challenges. As a Hardware Engineer Intern in semiconductor research, you will work with world-class global researchers focused on enabling next-generation chips and systems that support the tremendous processing power and unprecedented speeds required for next generation logic/memory technology and support applications such as hybrid cloud and artificial intelligence.

Your Role and Responsibilities

This is for a 2025 summer internship with the following start dates: May - August or June - September for quarter system schools.

In this role, you will investigate the feasibility of applying science and engineering principles towards innovative, new hardware design and applications from state-of-the-art chip architecture, design, fabrication and test to advanced chip packaging. Background knowledge of engineering disciplines, computer science, physics, or materials science are ideal skills for this role. Interns are expected to have the ability to analyze complex problems and apply creative solutions to groundbreaking hardware engineering projects.

• Candidate should be pursuing a Bachelor's Degree.
• Electrical engineering
• Mechanical Engineering
• Computer Science
• Materials Engineering
• Physics/Chemistry

• Semiconductor fabrication knowledge
• coursework