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In our R&D BiMOS semiconductor chip groups at Hitachi Energy Semiconductors, we are developing faultless high-tech different semiconductor devices across difference voltage classes. Our quality products are manufactured in advanced internal and external production sites and then delivered to a wide range of customers worldwide for different applications, e.g. industrial, renewable energy, traction and E-mobility.
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We are currently looking for a strong motivated R&D Technical lead / Project manager to power the future of semiconductor chip technology and product development, by shaping the next generation of low and high voltage IGBTs and MOSFETS Si and SiC devices.
Do you combine a strong technical background with sound leadership skills? Are you passionate to work in a high-tech company to write the future? Then apply today! Our team spirit and work practices help you to reach personal and business performance while creating an environment where all employees can develop their skills and grow.
The opportunity
In this position, you will play a pivotal role in the development of advanced power semiconductor device products, including both low and high voltage IGBTs and MOSFETs, Si as well as SiC chips. You will collaborate closely with design and process specialists to establish technology goals, features, and integration plans.
Your expertise will drive innovation, enhance performance, and position you at the cutting edge of technology and product development. Leveraging your project management and leadership abilities.
You will bridge technical features with execution strategies, ensuring project success by meeting performance, cost, quality, and time-to-market requirements.
How you'll make an impact
- Lead the development activities of new Si and SiC power chips from concept to final product, while improving product performance within cost, quality, and timeline constraints
- Overseeing product development project(s) and requirements including constant resource planning, risk management, monitoring and reporting
- Contribute and work closely with design team, TCAD specialists and application experts to set technology goals, features, and process integration strategies
- Working with unit process specialists to define process requirements in line with the technology roadmap
- Assisting in the yield improvement and ramp-up phases of new technology platforms alongside process integration and unit process and product engineers
- Regularly interacting with product management as well as electrical and reliability experts to understand and challenge the requirement to ensure qualification and release of new technologies and products
- Oversee technical analysis of competitive technologies and new product benchmarking
- Demonstrating a keen desire to expand your knowledge and understand the broader context and transfer the understanding to the project team
Your background
- Master or PhD in Physics or Electrical Engineering or similar field, ideally specialized in semiconductor device technology area
- Extensive working experience in product/technology development or process integration (IGBT, MOSFET, Diode), ideally within power semiconductor (mainly Si, SiC chips)
- Proven track record of project management experience in relevant area
- In-depth knowledge of semiconductor device physics, design, functionality, characteristics and processes
- Self-motivated person who strives for performance, quality, and lasting relationships in our team and with various stakeholders
- A structured and open-minded character, willing to explore challenging innovative approaches, and drive efficient and effective development, while adhering to tight deadlines
- Proficiency in English with Strong communication and presentation skills
Apply now