At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.
Position Description:
The candidate will focus on Chip, IC Packaging, Board space and 3D-IC application development. The candidate will work with customers to deeply understand their requirements, and discuss these with the factory to develop the required software.
Position Requirements:
o Programming skills: C/C++, or Java
o Other skills: Tcl, shell script, or Verilog
o Strong background in one of the following:
- Placement, Routing, Design Flow or Design Optimization
- Computational Geometry
- EDA Database
- System Engineering
- Application architecture for Artificial Intelligence
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o Knowledgeable in UNIX and Windows
o Knowledgeable in Electronic Device Nomenclature
o Ability to work individually or with a small distributed team
o Ability to interact professionally with the customer
o Ability to profile the values, requirements, issues, and risks.
o Ability to communicate in English
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