NVIDIA has been leading computer graphics, PC gaming, and accelerated computing for more than 25 years. It's an outstanding legacy of innovation that's fueled by great technology-and dedicated individuals. Today, we're tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what's never been done before takes vision, innovation, and the world's best talent. If you have the drive, experience, and passion to help NVIDIA take visual computing to the next level, we want to hear from you!

NVIDIA is looking for a highly motivated Thermal Engineer for its Advanced Research Group to architect and engineer advanced thermal management and packaging solutions for future accelerated computing server products. As a member of NVIDIA, you will be an integral member of an exciting and collaborative team that defines and develops advanced thermal solutions from concept through to prototype stage, followed by hand-off to Product Engineering for successful developments.

• Lead the thermal design and analysis for multiple advanced thermal solutions involving GPUs, servers, network switches, optical solutions, mid-board optical modules (MBOM), power delivery solutions, and closely related projects.
• Collaborate with NVIDIA's Product Design/Engineering and Thermal Engineering teams to develop requirements to ensure that all thermal solutions are properly aligned with future product directions.
• Collaborate with cross-functional teams, including Mechanical/Thermal Engineers, Electrical Engineers, and Product Designers, to ensure eventual effective integration of the thermal solutions into the overall product design.
• Conduct thermal simulations (computational fluid dynamics), analyses, and modeling using industry standard software tools to predict and optimize the thermal behavior of advanced thermal solutions.
• Design experiments, develop test procedures, plan tests, and direct Test Technicians to set-up test equipment, run tests, and analyze data for testing of the thermal solutions. Compare experimental results to predicted results and adjust models as needed.
• Continuously research methods of improving and optimizing cooling systems for thermal performance, power consumption, effective packaging in servers, and total cost of ownership.
• Own the thermal solution roadmap.

• Bachelor of Science (or equivalent experience) or Master of Science (preferred) in Mechanical Engineering or closely related field
• 5+ years' of relevant experience, preferably in the IT/electronics industry.
• Ability to design and build experimental set-ups to quantify the performance of the thermal solutions, along with experience with instrumentation, data acquisition systems, and power delivery systems. Thermal solutions will include air-cooling and hybrid air/liquid-cooling.
• Deep fundamental understanding of heat transfer and fluid mechanics.
• Ability to conduct complex thermal analyses using thermal engineering analysis tools such as IcePak, FloTHERM, and Fluent.
• Experience with CAD software such as Creo or SolidWorks.
• Capable of leading and owning multiple development efforts simultaneously.
• Excellent ability to present results of experiments and analyses to multiple engineering disciplines.
• Desire and ability to work in a dynamic and fast-paced environment.
• Excellent verbal and written communication skills in English.

• Experience with thermal management of electronics including servers, switches, and power supplies, with emphasis on hybrid air/liquid-cooling solutions.
• Background with thermal management of racks, rows of racks, and data centers.