NVIDIA is the industry leader in high performance computing, gaming and AI. Our GPUs and SOCs give outstanding performance and efficiency, revolutionizing myriad fields like cell research, robotics, crypto mining and so many more. We revolutionized the AI world by inventing CUDA. And we are just getting started.

Silicon Solutions Group (SSG) is a wide-ranging, multi-functional team at NVIDIA. We sit at the crossroads of design, architecture, marketing and productization. Our involvement begins at the arch stage and extends to defining final products. We architect and deliver innovative solutions for various markets like Gaming, Datacenters, Servers, Automotive and Embedded. We are fast-paced, multifaceted, share a sense of humor and collaborate extensively to push the boundaries of what is possible. We do all of this with an eye on making ground-breaking impacts in the markets we serve. If this sounds like something you want to do, read on. As part of the Silicon Solutions team at NVIDIA, you will be responsible for thermal solution design for silicon testing to bring our products from design to productization.

• Architect thermal solutions for next generation product characterization. Deliver these solutions from concept to lab.
• Design thermal soluitions from end to end, including initiatives and prototypes across multiple business units, while translating product characterization testing requirements to thermalsolution design requirements including equipment design and SW requirements for cooling solution automation.
• Lead thermal solutions design from roadmap, implementation plan, reuse strategy, review and sign off including trade-off proposals between thermal, mechanical, schedule and cost.
• Create pre-silicon and post-silicon design validation plan to make sure thermal solution designs are ready for silicon testing. Debug and root cause thermal related issues in order to meet temparature coverage requirement for characterization.
• Improve thermal design process. Drive the enhancement plan from incorporating the design feedback and learnings, and improve the design workflow and process.
• Working alongside system architects, chip and board designers, and software/firmware engineers on thermal design and implementation, in a multifaceted and high-energy work environment to bring industry-defining products to market.

• Master in EE, Thermal/ Energy, Mechanical Engineering or relative majors, with 8+ years relevant experience.
• Strong understanding of thermal management principles and fluid dynamics.
• In-depth knowledge of sophisticated cooling solutions, high heat flux problems.
• Outstanding communication and program management skills.
• Proficiency in CAD software for creating and modifying 3D models of electronic components and cooling systems.
• Good silicon testing, board design and software knowledge.