For two decades, NVIDIA has pioneered visual computing, the art and science of computer graphics and data centers products. With our invention of the GPU - the engine of innovative visual computing - the field has expanded to encompass personal computer games, movie production, product design, artificial intelligence, medical diagnosis and scientific research. Today, visual computing is becoming increasingly central to how people interact with technology, and there has never been a more exciting time to join our team. NVIDIA is now passionate about innovation at the intersection of visual processing, high performance computing, and artificial intelligence.

Beside being a leader in AI, NVIDIA has entered the Automotive graphics' segment with GPUs since 2006. Since then, we have increased our product offerings to include complete graphics support for customer navigation and instrument clusters. It is an exciting time for the auto industry, as the car is becoming a connected system, and graphics and computing power is redefining the automobile. NVIDIA is at the forefront, providing high-end to mid-level performance solutions for these meaningful changes in automotive industry, We are now looking for a Senior Reliability Engineer. The position is an individual contributor role, working with the cross-functioning teams. Below are the required key responsibilities of the position.

• Develop product level reliability qualification plan and implement the qualifications of new NVIDIA products. These include IC chips in AI, Data Center, Mobile, Automotive, Deep learning, Graphic Processor, and System on Chip sectors. These devices are assembled in either FCBGA, or COWOS, or Multi-Chip Module package. Majority of NVIDIA new products today are made of Fin-FET technologies with advanced process node.
• Work closely with design, Customer engineering, product/test engineering and packaging engineering team to develop reliability qualification plan.
• Work closely with DFT team and product engineering team for qualification test program, validation and run data analysis on pre/post reliability stress tests. Work with product engineering team to define device specification and margin study on critical parameters.
• Investigate and analyze failures and failure mechanism, analyze data and develop failure models. Drive corrective and preventive actions and project field failures. To effectively handling these tasks, the engineer must have skills in mathematical analysis and reliability modellings to improve product quality and reliability stress-effectiveness.
• Participate in assessment of reliability test requirements for non-conforming materials; and maintain and improve reliability database.
• Have ability to communicate clearly and produce product reliability qualification reports and presentations.

• Strong technical background in wafer fab with advanced process node, and Flip Chip BGA and COWOS packaging and assembly process technologies.
• You are equipped with knowledge of CMOS/Fin FET devices physics, and familiar with reliability statistics, and models and its failure mechanisms.
• Must be Familiar with industry standards (like JEDEC, IPC, AEC-Q100) for Silicon Die and package level qualification. Familiar with ESD/LU testing procedure and its associated risk assessment.
• Proficient in reliability data analysis tool such as JMP, Weibull++ and/or Minitab
• 5+ years of experience in IC reliability
• BS or higher degree in Electrical Engineering, Computer Engineering or equivalent experience. MS or PhD. in EE is preferable.