The NVIDIA Networking IC Co-Packaged Optics Engineering team is seeking an experienced Senior Optical Process Engineer for co-packaged optics products. This role involves close collaboration with various IC Product Engineering teams, including hardware, test engineering, and product engineering, as well as the Operations team and leading semiconductor vendors and assembly/test providers worldwide. The position requires a strong understanding of optical assembly process, active optical alignment equipment and processes to ensure stable, efficient, and smoothly running production line. This enables high availability while maintaining the quality of products shipped to customers.

What you'll be doing:

• Ensure end-to-end assembly process readiness for CPO products at NV manufacturing partners.
• Collaborate closely with RnD, PE and Operations to ensure robust manufacturing capabilities and reliability of CPO products and assure mass production is running smoothly.
• Yield analysis monitoring and drive continues improvement initiatives for NPI production lines, ensure optimal yield and efficiency to achieve NVIDIA capacity and cost target.
• Maintain products' quality by improving design and manufacturing process as well as equipment stability.
• Provide onsite engineering support: technical ownership and support for process or equipment issues.

• BS/MS degree in Mechanical Engineering, Optical Engineering, Material Science and/or related field.
• 5+ years' experience in relevant fields - mass production, optical alignment process development, and data processing & analysis.
• Participate in the process of bringing up a new technology from the R&D stage to high volume manufacturing.
• Hands-on debug experience with strong problem-solving ability.
• Proficient in SPC, 6 sigma, quality control process; good understanding of machine and process interactions.
• Excellent communication/presentation skills in English.
• We are seeking applicants who demonstrate the ability to work independently, deliver results promptly, communicate effectively, operate with a sense of urgency, and thrive in a fast-paced development and production environment.

• Knowledge in Flip Chip Packaging / multi-chip module/ hybrid bonding / Optical Connector Assembly/ Optical Connector to chip attach.
• Hands-on experience working with machines and optimize process recipes.
• Knowledgeable in DFx, FMEA process, and failure analysis methodologies.
• Know-how of yield analysis and process cycle time reduction methodology.
• Experience working with OSAT in volume manufacturing environment as well as a background with the semiconductor or optical communication industry.