NVIDIA is a leading provider of cutting-edge technology solutions in the semiconductor industry. We specialize in the development and enhancement of integrated circuits (ICs) for a wide range of applications, including consumer electronics, automotive, and telecommunications. Our team is dedicated to innovation, quality, and pushing the boundaries of what is possible in the world of microelectronics. We are seeking a highly skilled and motivated failure analysis engineer to join our team. You will play a critical role in the modification and optimization of integrated circuits at various stages of the design and manufacturing process by performing focused ion beam (FIB) circuit editing. You will work closely with design engineers, process engineers, and failure analysis teams to ensure the functionality, reliability, and performance of our products.

• Circuit Modification: Perform precise circuit modifications at the transistor and interconnect level using focused ion beam (FIB) and other advanced techniques to edit IC layouts for debugging, enhancement, and prototyping purposes.
• Design Verification: Work closely with design engineers to verify that circuit modifications meet functional specifications and design requirements. Provide feedback on potential design improvements.
• Prototyping and Validation: Modify and optimize circuits for prototyping and validation purposes, enabling effective iterations of design improvements and new product development.
• Failure Analysis Support: Collaborate with failure analysis teams to identify and correct design flaws in ICs. Use circuit editing tools to modify and re-test circuits to verify fixes.
• Process Optimization: Assist in the development and optimization of circuit editing processes, tools, and methodologies to improve efficiency and precision in circuit modifications.
• Maintain detailed documentation of circuit editing activities, including modification logs, test results, and process improvements. Communicate findings and recommendations to cross-functional teams, and perform various FIB sample preparation tasks for TEM, nanoprobing, and e-beam probing.
• Tool Maintenance: Ensure the proper maintenance and calibration of equipment, including FIB systems, scanning electron microscopes (SEM), and other relevant tools for special projects.
• Training and Mentorship: Provide training and mentorship to junior engineers and technicians in circuit editing techniques and best practices.

• Master's degree or higher in electrical engineering, Microelectronics, Physics, or a related field (or equivalent experience).
• Minimum of 3-5 years of experience in circuit editing, semiconductor device physics, or related roles within the semiconductor industry.
• Proficiency in circuit editing tools, including FIB, SEM, and electron-beam lithography.
• Strong understanding of semiconductor device physics, IC design, and fabrication processes.
• Experience with EDA (Electronic Design Automation) tools and layout editing software.
• Knowledge of failure analysis techniques and methodologies
• Strong problem-solving skills with the ability to diagnose and resolve complex circuit issues.
• High level of precision and attention to detail in performing circuit modifications.
• Excellent written and verbal communication skills, with the ability to effectively collaborate with cross-functional teams.
• Ability to work effectively in a team-oriented environment, as well as independently when necessary.

• Experience in advanced technology nodes (e.g., 7nm, 5nm, or below)
• Experience in various sample preparation techniques.
• Familiarity with scripting languages for automation of circuit editing processes.
• Knowledge of advanced failure analysis techniques, such as transmission electron microscopy (TEM) or atomic force microscope (AFM).