Northrop Grumman's semiconductor foundry, packaging, integration, and test lines have unique capabilities that support a range of microelectronic production and provide leading-edge technology development.
The Apopka Florida wafer bumping µ-Line will support flip chip, 2.5D, and 3D packaging for internal production customers as well as emerging technology programs. The line will provide a range of bump compositions. Techniques will include sputter, electro-plating, and solder-sphere transfer to support flip chip, 2.5D, and 3D packaging using 100 mm to 300mm wafers. The devices supported in Apopka will also be subjected to singulation and die/wafer probe testing. The Manufacturing Engineer will support and sustain a wide range of manufacturing systems in Advanced Packaging.
Core Responsibilities include:

Will work with diverse groups within Northrop, including Global Supply Chain, IE's, Planning, Process Engineers, and shipping and receiving.
* Create and maintain master routers in the MES system with guidance from Engineering and production.
* Update work order routers based on requests submitted by engineering and production management.
* Gather GDS files and program/foundry information to complete mask reviews with engineers and ensure layouts meet all design rules and guidelines.
* Use GDS files and program/foundry information to create an Apopka die drawing specific to each program for engineers, technicians, and operators to use to run the product.
* Member of Configuration Management team to review and approve program drawings
* Administrator for MES system for all production routers, reworks, special instructions, and OCAPs
* Routine user of SAP and MPLM systems
* Routinely work with IE and ME to improve production workflows in MES which results in cycle time improvements and cost reduction
* Support multiple wafer bumping processes and wafer sizes.
* Support, as required, workflow and drawing interface activities between wafer bumping lines, site management, and internal programs.
* Incorporates engineering changes into the work process and MES system.
* Coordinates with production on day-to-day activities. Assists in the resolution of production workflow issues.
* Support manufacturing capacity planning optimization for responsible production lines
* Support Digital Transformation initiatives
* Accountable for process control, quality, safety, delivery, and rework metrics for responsible production lines
* Train engineering and production on MES system and functions
* Ability to collaborate in a team environment
* Solid presentation skills with the ability to effectively communicate thoughts and ideas
* Commitment to ethics and compliance
* High daily use of computer-based systems to perform responsibilities
* Expert level in computer skills
* Expert in Microsoft applications
Basic Qualifications

Bachelor's degree in science with 2 years of experience in engineering, production assembly/fabrication, or production manufacturing operation; Or master's degree with 0 years of experience in engineering, production assembly/fabrication, or production manufacturing operation. Note: An additional 4 years of experience in engineering, production assembly/fabrication, or production manufacturing operation may be considered in lieu of a degree.
* Experience in a manufacturing environment
* Experience in collecting and analyzing production data to identify trends and help make decisions regarding process improvements.
* Ability to obtain and maintain a DoD Secret clearance
* US Citizenship
Preferred Qualifications

Experience using SPC and Six Sigma techniques.
* Prior experience with semiconductor-industry-capable MES systems
* Experience in flip-chip, 2.5D, and 3D packaging
* Aerospace or defense product experience
* Complete understanding and wide application of technical principles, theories, and concepts in the field
* High proficiency experience in Root Cause Corrective Action (RCCA) problem-solving and Continuous Improvement (CI)
* Experience in Failure Mode and Effects Analysis (FEMA) and Design of Experiments (DOE)
* Broad technical experience in Value Stream manufacturing operations
* Experience with SAP S/4 HANA Cloud ERP system
* Experience in CREO CAD Software or equivalent
MANUMS
Salary Range: $70,200 - $105,400
The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.
Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.