Northrop Grumman's ATL semiconductor foundry is a unique capability supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, and Silicon Carbide) and providing leading edge technology development in superconducting electronics. Our devices enable a number of Northrop Grumman's ground based radars, avionic radars, and space systems.
Join us for the chance to work with an amazing, experienced, and talented team while helping serve your country. Enjoy the opportunity to grow and learn with a variety of challenging projects in R&D, ongoing long term programs, and new programs targeting future military platforms.
Our multidisciplinary foundry team enables activities from development to sustainment process engineering. ATL is responsible for all aspects of semiconductor technology including design, mask making, wafer fabrication, test, and assembly. The candidate must be a strong team participant, have excellent communication skills, and be resourceful and multitalented. A strong understanding of semiconductor technology, metrology processes, and equipment engineering is essential.
The 5th shift PVD Process Engineer should demonstrate an ability to communicate well with others and work equally well independently and as part of a team.
The 5th shift PVD Process Engineer will be responsible for but not limited to:
• All aspects of sustaining PVD processes for semiconductor manufacturing. This includes process qualifications, technician training and certification, and process safety
• Interfacing with other unit process engineers and product integration engineers to develop processes to support emerging technologies
• Supporting statistical process control (SPC) and continuous improvement efforts
• Establishing standard operating procedures and engaging the operations team to ensure these are followed
• Training technicians and maintaining process documentation
• Performing all other related duties as assigned
#NGATL
The 5th shift is Friday-Sunday, 7:00PM-7:00AM.
This requisition maybe filled at either Associate Physical Vapor Deposition (PVD) Process Engineer or Physical Vapor Deposition (PVD) Process Engineer
Basic Qualifications for Associate Physical Vapor Deposition (PVD) Process Engineer:
• Bachelors in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or other related technical discipline with 1 year related experience
• Must have basic understanding/knowledge of semiconductor physical vapor deposition (PVD) or other related semiconductor fabrication techniques
• Experience with semiconductor fabrication and working in a cleanroom environment
• Must possess good interpersonal and communication skills, both written and verbal, problem solving skills with ability to work with a diverse group of people including technicians, engineers and management
• Must be able to work a large percentage of time in a Class 100 cleanroom environment and be able to meet all physical and PPE requirements
• Ability to obtain and maintain a Secret clearance
• Must be a US citizen
• Must be able to work 5th shift is Friday-Sunday, 7:00PM-7:00AM
Basic Qualifications for Physical Vapor Deposition (PVD) Process Engineer:
• Bachelors in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or other related technical discipline with 2 years related experience; Master's degree with 0 years of experience
• Must have basic understanding/knowledge of semiconductor physical vapor deposition (PVD) or other related semiconductor fabrication techniques
• Experience with semiconductor fabrication and working in a cleanroom environment
• Must possess good interpersonal and communication skills, both written and verbal, problem solving skills with ability to work with a diverse group of people including technicians, engineers and management
• Must be able to work a large percentage of time in a Class 100 cleanroom environment and be able to meet all physical and PPE requirements
• Ability to obtain and maintain a Secret clearance
• Must be a US citizen
• Must be able to work 5th shift is Friday-Sunday, 7:00PM-7:00AM
Preferred Qualifications:
• Hands-on experience in metal evaporation and/or sputtering techniques, equipment and practices
• Experience in lean manufacturing practices and structured problem-solving methodology, DOEs
• Knowledge of statistical process control (SPC), JMP, Minitab
• Active Secret clearance
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Salary Range: $68,800 - $103,200
Salary Range 2: *$83,300 - $124,900
The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.
Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.