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Description and Requirements
• About Organization
-Yokohama development team is leading development of ThinkPad products. The department of this open recruitment is taking charge of mechanical design for system integration and cooling mainly.
• Roles and responsibilities
-Lead mechanical design for PC system overall, integration and cooling.
-Handle product execution work
-Collaboration with ME/ID/EE team for system integrated thermal design
-Develop thermal design to achieve good cooling performance and UX (Skin temperature, FAN noise).
-Mechanical design for thermal parts by 3D CAD
-FAN, Heatsink, Heat pipe, Vapor chamber, Graphite sheet
-Mockup creation / evaluation
-Ensure cooling capability for TDP requirement
-Overseas Thermal supplier management for design and quality
-Communication with ODM team
-End-to-end development
PoC > NPI > MP > Care for customer voice > Feedback to next generation
• Key Interaction with:
-ThinkPad development team (ID/ME/EE)
-ThinkPad NPI (New product introduction) team
-ThinkPad GCM (Global commodity management) team
-ThinkPad SQE (Suppler quality engineering) team
-ThinkPad PA (Product assurance) team
-Thermal team of Lenovo group (USA, Japan, Taiwan, China)
-SoC vendor
-Cooling device parts supplier
Additional Locations:
* Taiwan - Taipei City