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Description and Requirements
岗位职责:
1,ASIC IC芯片后端设计从RTL到GDSII;
2,具备完整的芯片Tapeout经验,后端布局规划(模块级或全芯片级);
3,熟悉STA静态时序分析及低功耗设计与分析;
4,物理验证能力LVS/DRC/ERC/LVL/RTO/ANT/LUP;
5,布局布线,电源网络设计,时序收敛,功耗分析,物理验证等,掌握其中一或多个技能。
任职要求:
1. 电子工程本科及以上学历,1-3年物理设计实现相关工作经验;
2. 熟练使用主流数字后端设计平台工具,具有TCL/Perl等脚本编程经验;
3. 具备以下单项或多项经验:从RTL到GDS的芯片、复杂模块级设计实现,芯片级测试,ASIC设计和仿真,ASIC物理版图,集成电路制造和工艺;
4. 能够帮助和带领初级工程师解决问题;
Additional Locations:
* China