Description

Leidos Dynetics is seeking a talented Sr. Manufacturing Engineer to join a diverse team to create unique solutions for complex problems. With offices across the United States engaging in the defense, space, cyber and commercial fields, Leidos Dynetics provides responsive, cost-effective engineering, scientific and IT solutions.

Primary Responsibilities

Candidate will develop, document, and execute manufacturing processes and procedures for electronic and electromechanical products. Candidate will support production of printed circuit board assemblies (PCBA's), cable assemblies, and electromechanical assemblies and systems. Applicant will work with a multi-disciplinary team to develop a wide variety of hardware, and work with the latest automated technology used in assembly and test equipment. Candidate will support tasks such as review and approval of engineering drawings, bills of materials, customer quality requirements, and work instructions; support CAPEX activities by performing equipment research/validation; participation in design reviews; provide mentorship to junior engineers; perform root cause analysis and mitigation plans; and execution of manufacturing activities. Candidate will be required to work closely with the design team to complete all details of the design, to prepare the design for release to manufacturing. Candidate will also work closely with our quality team to develop processes that validate customer quality requirements. Candidate will work closely with production control to meet desired delivery schedule of design team.

• Candidate will have a BS degree in engineering (or similar science/technical discipline) from an accredited university with at least 8 years of relevant experience. In lieu of degree, a high school diploma with 12 years of relevant experience will be considered.
• Ability to provide Rough Order of Magnitude (ROM) estimates, Basis of Estimate (BOE) documents, and other documents used to support proposal efforts will be a plus.
• Experience with Costpoint Material Planning software and/or Agile product lifecycle management software is a plus. Experience in various quality roles is also a plus. Experience in using Manufacturing Execution Systems (MES) is also a plus.
• Candidate must be a resident of Huntsville, Alabama or be willing to relocate to the Huntsville, Alabama area.
• Candidate must be a US Citizen and possess (and be able to maintain) a Final Secret Clearance or meet the eligibility requirements to obtain (and maintain) a Secret Clearance.

• Preferred candidate will have at least 8 years of manufacturing engineering experience on designing and building electronic hardware to government specifications (or similar).
• Preferred candidate will have knowledge of J-STD and IPC manufacturing standards to include PCBA assembly, cables and wire harness assembly as well as electromechanical assembly.
• Preferred candidate will have experience with software that maintains bills of materials, and other engineering design data.
• Preferred candidate will have experience in SMT (Surface Mount Technology) processes and equipment.
• Preferred candidate will have experience with space applications, electronics used on launch vehicles, targets, or missile components, and with production of cable harnesses, electronics, and electromechanical assemblies.