Description

Leidos Dynetics is seeking a talented Manufacturing Process Engineer to join a diverse team to create unique solutions for complex problems. With offices across the United States engaging in the defense, space, cyber and commercial fields, Leidos Dynetics provides responsive, cost-effective engineering, scientific and IT solutions.

Primary Responsibilities

Candidate will develop, document, and execute manufacturing processes and procedures for electronic and electromechanical products. Candidate will support production of printed circuit board assemblies (PCBA's), cable assemblies, and electromechanical assemblies and systems. Applicant will work with a multi-disciplinary team to develop a wide variety of hardware, and work with the latest automated technology used in assembly and test equipment. Candidate will support tasks such as review and approval of engineering drawings, bills of materials, customer quality requirements, and work instructions; participation in design reviews; and execution of manufacturing activities. Candidate will be required to work closely with the design team to complete all details of the design, to prepare the design for release to manufacturing. Candidate will also work closely with our quality team to develop processes that validate customer quality requirements. Candidate will work closely with production control to meet desired delivery schedule of design team.

• Candidate will have a BS degree in engineering (or a science or technical discipline) from an accredited university with at least 2 years of relevant experience or equivalent combination of education and experience.
• Ability to provide Rough Order of Magnitude (ROM) estimates, Basis of Estimate (BOE) documents, and other documents used to support proposal efforts will be a plus.
• Experience with Costpoint Material Planning software and/or Agile product lifecycle management software is a plus. Experience in various quality roles is also a plus. Experience in using Manufacturing Execution Systems (MES) is also a plus.
• Candidate must be able to demonstrate strong leadership skills, attention to detail, and ability to work independently. Ability to multi-task well is also essential.
• Candidate must have experience working with design engineers, manufacturing engineers, and technicians to develop a build strategy and identify any problems that could occur during assembly.
• Candidate will be required to have the basic computer skills associated with these assembly tasks (such as retrieving the manufacturing documentation from the system, updating the system as router steps are completed, etc.).
• Candidate must be a resident of the North Alabama area or willing to relocate to the Huntsville - North Alabama, AL area.
• Candidate must be a US Citizen and possess (and be able to maintain) a Final Secret Clearance OR meet the eligibility to obtain (and maintain) a Secret Clearance.

• Preferred candidate will have at least 3 years of manufacturing engineering experience on programs designing and building electronic hardware to government specifications (or similar).
• Preferred candidate will have experience in SMT (Surface Mount Technology) processes and equipment.
• Experience with software that maintains bills of materials, and other engineering design data.
• Experience with electronics used on launch vehicles, targets, or missile components, and with production of cable harnesses, electronics, and electromechanical assemblies.
• Communicate with customers to provide updates on both schedule and cost
• Experience in various quality roles is also a plus.
• Experience in using Manufacturing execution systems (MES) is also a plus.
• Electronic component handling requirements and ESD procedures.
• Current or prior certification to IPC/WHMA-A-610 & J-STD-001.