Introduction
As a Hardware Developer at IBM, you'll get to work on the systems that are driving the quantum revolution and the AI era. Join an elite team of engineering professionals who enable IBM customers to make better decisions quicker on the most trusted hardware platform in today's market.

Your Role and Responsibilities

IBM's Research Division is looking for an experienced bonding & assembly research engineer with knowledge on Die-to-wafer, Die-to-laminate, reliability, and failure analysis to support the chiplet and advanced packaging initiatives for IBM Semiconductors in Albany, New York.
The engineer would be part of a multi-disciplinary, multi-cultural, research and development center that brings together advanced logic technologies nodes with next-generation semiconductor packaging technologies.

• Required Education: master degree
• Experience with flip chip underfill/molding process
• Experience with flip chip assembly (Die-to-Die, Die-to-wafer, Die-to-substrate)
• Basic understanding of packaging/assembly processes, material, laminate, and tools
• Ability to debug errors and solve problems
• Ability to work in a team environment

• Preferred Education: Ph.D.
• Hands-on experience in semiconductor packaging technology
• Experience in flip chip assembly process, laminate technology,
• packaging reliability test, failure analysis, and semiconductor process.
• Experience with/ design of experiments, process controls, and statistical data analysis.