Introduction
IBM Research takes responsibility for technology and its role in society. Working in IBM Research means you'll join a team who invent what's next in computing, always choosing the big, urgent and mind-bending work that endures and shapes generations. Our passion for discovery, and excitement for defining the future of tech, is what builds our strong culture around solving problems for clients and seeing the real world impact that you can make.
IBM's product and technology landscape includes Research, Software, and Infrastructure. Entering this domain positions you at the heart of IBM, where growth and innovation thrive.
Your Role and Responsibilities
At IBM Research, we invent things that matter to the world. Today, we are pioneering the most promising and disruptive technologies that will transform industries and society, including the future of Hybrid Cloud, AI, and Quantum Computing. We are driven to discover and innovative. With more than 3,000 researchers in 12 labs located across six continents, IBM Research is one of the world's largest and most influential corporate research labs.
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We are seeking hardware integration engineer with expertise in back side power rail distribution for logic applications. The candidate should have deep expertise in 300mm wafer bonding of Si-CMOS logic devices. The BSPDN integration engineer will be working with a world class team on research and development of the most advanced technology nodes, continuously pushing the boundary of logic technology with partners and clients worldwide.
You must be willing to work in IBM research center in Albany, NY as the primary work location. You must be willing to work an alternate schedule including some evenings/weekend as needed.
A degree in physics, material science/engineering or a related area is required. Bachelors degree with +8 years or Master's degree with +5 years or Ph.D. with +4 years of semiconductor related experience.
Required Technical and Professional Expertise
You should have one or more of the following experiences and skills
- Experience with 300 mm wafer bonding / Cu interconnect process integration.
- Experience with Heterogeneous integration is a plus
- High degree of experience in semiconductor device integration, process development: prior experience at a leading a 300mm semiconductor FAB is a plus.
- Intermediate level of lithography alignment strategies
- Expert level of experience and knowledge of Si-CMOS integration: Back End of the Line (BEOL) and middle of line contact modules (MOL)
Preferred Technical and Professional Expertise
- Knowledge and experience with Silicon CMOS technology qualification
- Attention to detail, data summary analysis leading to conclusion and ability to multi-task.