Through detailed models, drive design optimization and provide recommendations to system architects.
Attention to tradeoffs involving all facets of system development (e.g. RF electrical performance of both passive and active components, thermal-mechanical constraints, chemical / metallurgical issues, manufacturability / cost constraints, etc.)
Organize and manage research and development projects to be carried out by technical teams of other domain experts (e.g. in each of the technical areas mentioned above).
Provide mentorship and guidance to others in all aspects of these projects (technical, organization, reporting, etc.).
Develop and maintain relationships with relevant vendors and partner organizations, as well as with other internal leads and teams working on other system elements.
Must have excellent communications skills, organizing and presenting results in written reports and oral presentations.
Must create and manage work plans to meet or exceed schedule deadlines and technical expectations.
Must lead and contribute to proposal and marketing efforts required to sustain continued R&D efforts.

Required Skills:
More than 10 years of experience in designing and analyzing complex systems and components, with a particular emphasis on thermal and mechanical properties.
Demonstrated success in solving tough technical problems in the following areas: structural design, thermal engineering, and fluid dynamics.
More than 5 years of experience developing external partnerships and vendor relationships, organizing and leading technical research and development efforts, and in preparing presentations and proposals needed to attract research funding.
Basic background knowledge across all domains relevant to mixed signal systems (e.g. thermal-mechanical design, integrated circuit design, semiconductor processing and associated material science, control system theory, etc.) with deeper background knowledge in thermal management principles. Proficiency in thermal analysis software and simulation tools (e.g., ANSYS, Fluent, Thermal Desktop). Experience with CAD design (e.g. SolidWorks), FEM analysis, analytical and numerical methods for solving real-world 1D, 2D, and 3D heat flow and mechanical (e.g. stress/strain) problems.
Experience with associated laboratory techniques such as thermal measurements and yield analysis.
Familiarity with standard system engineering practices and terminology.
Use of Microsoft Office tools (Word, Excel, Powerpoint) and proficiency in writing for reporting.
Proficiency in use of computers, engineering workstations, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environment. Ability to work well in a team and independently.

Required Education
MS or Ph.D. in Electrical Engineering, Physics, Material Science, or related scientific discipline.

Physical Requirements:
Must be sufficiently mobile to work within confined spaces and have both visual and hearing acuity.

Special Requirements:
U.S. citizenship
Must be able to obtain and maintain a security clearance. Active SSBI strongly preferred

Compensation:
The base salary range for this full-time position is $163,150 - $209,088 + bonus + benefits.
Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range during the hiring process. Please note that the compensation details listed reflect the base salary only, and do not include potential bonus or benefits.