Essential Duties:
Hands-on semiconductor wafer and/or component fabrication, integration, packaging and assembly. Perform, develop, and refine fabrication processes.
Inspect product at critical steps. Troubleshoot and resolve process problems.
Work closely with senior technical staff to perform experiments and document experimental findings.
Collect and analyze experimental data. Work with unit process engineers in order to fabricate wafer lots and execute experiments.

Required Skills:
Experience with hands-on processing of semiconductor devices, circuits, components and/or packaging are strongly desired. Familiarity with one or more of following processes is preferred: wafer or die bonding; die attach; underfill; wire bonding; non-destructive or destructive analysis such as wire pull, die shear test.
Experience with microscope, profilometry, and SEM inspection of wafers and die is a plus.
Depending on the existing skill set of the engineer, on the job training will be available for cleanroom practices, operating various semiconductor processing equipment, inspection techniques, MES understanding, metrology and data analysis skills.

Physical Requirements:
Ability to work in a cleanroom environment.

Special Requirements:
Must be a US Citizen. Ability to obtain and maintain a security clearance.

Compensation:
The pay range for this position is $36.79 - $44.87 per hour + bonus + benefits.

Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the target for new hire salaries for the position. Individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specifics during the hiring process. Please note that the compensation details listed reflect the base salary only, and do not include potential bonus or benefits.