Line management duties include managing resources, talent acquisition (e.g., recruiting), staff professional development/mentorship and additional department-wide, lab-wide, and HRL-wide strategies & assignments. Technical duties require candidate to participate in the development of lab-wide strategies, lead research and development of novel 2.5D and 3D heterogeneous integration technologies for RF and mmW applications (e.g. next generation RF/mmW Phased-Array Systems), with attention to all facets of this endeavor from conceptual design phase considering electrical, thermal, mechanical design constraint to engineering and manufacturing, as well as verification and validation phase. Provide mentorship and guidance to others in all aspects of these projects (technical, organization, reporting, etc.). Organize and present results, in written reports, journal papers, and oral presentations. Create and manage work plans to meet or exceed schedule deadlines and technical expectations. Strong leadership and contributions to proposal and marketing efforts required to sustain continued R&D efforts.

Experience Desired:
•More than 15+ years of hands-on experience with developing novel 2.5D and 3D microelectronic packaging and heterogeneous integration for RF & mmW microsystems.
•At least 3-5 years of experience in a role involving leadership of highly trained technical staff
•Extensive experience with design of experiments and analysis techniques (electrical, mechanical, thermal, chemical, etc.) needed to develop and assess new process integration modules and techniques.
•Experience with leading US government proposal and marketing activities. Demonstrated experience developing external partnerships and vendor relationships.
•Several years of experience in organizing and leading technical research and development efforts, and in preparing presentations and proposals needed to attract research funding.
•Experience with traditional as well as advanced packaging techniques (e.g. ceramic and laminate chip-level packages, printed circuit boards, SoC, SiP, MCM, HD interposers, etc.).
•Hands-on experience with semiconductor microfabrication is a plus.
•Candidates should possess a proven track record of developing novel and successful solutions to complex technical issues.

Knowledge Desired:
•Extensive knowledge of RF/mmW (0.1-200+ GHz) with strong electromagnetic (EM) background.
•Extensive knowledge of semiconductor microfabrication
•Knowledge of multi-physics simulation tools (e.g. ANSYS, COMSOL), high frequency and RF simulation tools (e.g. ADS, MWO, Cadence), electromagnetic simulation tools (e.g. HFSS or CST)
•Familiarity with digital, mixed-signal, power and signal integrity
•Knowledge of system engineering, program and project management is a plus.
•Understanding of material science, surface chemistry, semiconductor physics, and thermal/mechanical theory related to electronics processing and assembly techniques is a plus.

Required Education:
MS or Ph.D. degree in Electrical Engineering, Mechanical Engineering, Physics, or related scientific discipline.

Physical Requirements:
Proficiency in use of computers, engineering workstations, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environment. Ability to work well in a team and independently. Must be sufficiently mobile to work within confined spaces and have both visual and hearing acuity.

Special Requirements:
US citizen status is required. Ability to obtain and maintain a US Government Security Clearance. An active security clearance is a plus.

Compensation:
The base salary range for this full-time position is $182,720 - $234,168 + bonus + benefits.

Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the target for new hire salaries for the position. Individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specifics during the hiring process. Please note that the compensation details listed reflect the base salary only, and do not include potential bonus or benefits.