Minimum qualifications:
- Bachelor's Degree in Mechanical Engineering, Product Design, or equivalent practical experience.
- 8 years of experience in design and analysis of electro-mechanical systems and products.
- Experience in Chip Package Interaction (CPI), packaging materials, process, thermal, and package design.
- Experience in technical leadership and innovation.
- PhD in Engineering or a related field.
- Experience with 2.5D silicon interposer and silicon bridge technologies.
- Experience in designing and analyzing structural engineering fundamentals and material properties/science. Experience in designing complex electro-mechanical assemblies, mechanical tolerances, and tolerance analysis.
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About the job
In this role, you will work with the chip-package team and hardware (HW) system team to explore new system architecture for Machine Learning (ML) systems, leveraging advanced package technologies, Printed Circuit Board (PCB) technologies, interconnects and track solutions, that will enable scale up performance of future generations of ML systems. You will be directing and exploring package and system physical co-design solutions, through early feasibility exploration with test vehicles and hardware prototyping, with focus on achieving thermal, mechanical, interconnect and power delivery performance targets that are scalable to high volume manufacturing. Additionally, you will work with multi-functional cross teams from different organizations, and various suppliers to enable the new ML hardware system.
Behind everything our users see online is the architecture built by the Technical Infrastructure team to keep it running. From developing and maintaining our data centers to building the next generation of Google platforms, we make Google's product portfolio possible. We're proud to be our engineers' engineers and love voiding warranties by taking things apart so we can rebuild them. We keep our networks up and running, ensuring our users have the best and fastest experience possible.
The US base salary range for this full-time position is $168,000-$252,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target salaries for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google .
Responsibilities
- Lead the next generation Machine Learning (ML) system physical design, that spans from chips to data centers, this includes requirements gathering, concept generations, detailed design with analysis, and integrating new technologies.
- Influence and shape future products by providing mechanical and product design engineering knowledge into the technology road-map with data-driven decisions.
- Identify and scope projects around innovation opportunities as well as technology risks. Maintain and improve infrastructure development and qualification process.
- Lead and guide new infrastructure development products, working with multiple cross-functional internal teams and external ecosystem partners. Contribute to physical infrastructure road-map and architecture development.
- Lead execution of critical deliverables, for large infrastructure development products.