Minimum qualifications:
- Bachelor's in Science, Electrical Engineering, Computer Engineering or equivalent practical experience.
- 5 years of experience in the electronics manufacturing industry.
- Experience in generating product-specific test strategy, plans and executing testing accordingly with the knowledge of product design and manufacturing processes on Printed Circuit Board Assembly (PCBA).
- Experience in test development with agreement manufacturers, original design manufacturers (ODMs), or joint development manufacturers (JDMs).
- Experience in scripting languages like UNIX or LINUX.
- Experience in developing or integrating in-circuit test fixtures and instrumentation.
- Ability to communicate with agreement manufacturers and stakeholders in different locations.
- Ability to navigate and collaborate with stakeholders at executive levels across teams.
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About the job
Behind everything our users see online is the architecture built by the Technical Infrastructure team to keep it running. From developing and maintaining our data centers to building the next generation of Google platforms, we make Google's product portfolio possible. We're proud to be our engineers' engineers and love voiding warranties by taking things apart so we can rebuild them. We keep our networks up and running, ensuring our users have the best and fastest experience possible.
Responsibilities
- Conduct Design for Test (DfT) analysis and review to verify that in-circuit test accessibility and manufacturability meet DFT rules.
- Develop and implement the Manufacturing Structural Test Strategy for new products, and works with partners to ensure that structural test solutions meet product requirements.
- Lead and oversee the CM/ODM structural test development and deployment for Flying Probe, Boundary Scan, and In-Circuit Testing.
- Review structural test fixture strain gauge and GR&R performance for fixture qualification, and analyze test plan stability and coverage to meet Google expectations.
- Provide technical expertise and leadership in structural engineering throughout product life cycles. This includes driving test capacity readiness, supporting NPI builds and analysis, troubleshooting and root cause manufacturing yield issues and field escapes.