Minimum qualifications:
- Bachelor's degree in Mechanical Engineering or equivalent practical experience.
- 5 years of experience in design, analysis, and structure analysis.
- Experience with Finite Element Analysis (FEA) software (e.g., ABAQUS, Ls-Dyna, Ansys).
- Experience in testing including methods using Universal Testing Machines, and Dynamic Mechanical Analysis.
- Experience with mobile/consumer electronics devices, developing system design independently, and shipping in high volume consumer electronic products.
- Experience with 3D CAD systems (NX) and using good modeling practices, including model validation techniques.
Want more jobs like this?
Get jobs in Taipei, Taiwan delivered to your inbox every week.
About the job
Our computational challenges are so big and unique we can't just buy our hardware, we've got to make it ourselves. Our Platforms Team designs and builds the hardware, software and networking technologies that power all of Google's services. As a Mechanical Engineer you design and evaluate our data center systems, identifying product requirements and contributing to research and project planning. From the chip to chiller, you are responsible for designing and optimizing an architecture that will scale with Google's continued growth.
In this role, you will provide Finite Element Analysis (FEA) and support for multiple portable electronic consumer products.
The Google Pixel team focuses on designing and delivering the world's most helpful mobile experience. The team works on shaping the future of Pixel devices and services through some of the most advanced designs, techniques, products, and experiences in consumer electronics. This includes bringing together the best of Google's artificial intelligence, software, and hardware to build global smartphones and create transformative experiences for users across the world.
Responsibilities
- Generate FEA/analytical models of mechanical parts, modules, and assemblies.
- Perform static, dynamic, structural, and thermal-mechanical analysis.
- Own and drive material characterization and testing plans to support modeling efforts.
- Own, drive, and execute consistent methods of modeling and analysis of modules/system level across programs.
- Drive failure analysis, root cause efforts, and design of experiments to resolve difficult problems.