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Principal Solutions Engineer- AE

AT Cadence
Cadence

Principal Solutions Engineer- AE

Bangalore, India

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

• Develop and implement comprehensive PDN analysis methodologies for complex 3DIC packages, including CPU, GPU, and TPU structures.

• Perform detailed power noise and signal integrity simulations using tools like Cadence Sigrity PowerSI, Ansys HFSS, or equivalent.

• Identify and resolve power integrity issues, such as IR drop, ground bounce, and signal noise, to achieve sign-off criteria.

• Analyze and optimize signal integrity for high-speed interfaces in 3DIC packages, including HBM3, UCIE, and DDR5.

• Perform advanced SI simulations using industry-standard tools like Cadence Clarity, HyperLynx, Ansys HFSS, or equivalent.

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• Extract parasitic from 3D package layout and integrate them into SI simulations.

• Develop and implement design rules and guidelines for 3DIC package signal integrity.

• Collaborate with design engineers, layout engineers, and thermal engineers to optimize the PDN design and ensure proper heat dissipation.

• Stay up-to-date on emerging 3DIC technologies and trends and propose innovative solutions to improve power integrity performance.

• Document analysis results and findings clearly and concisely for internal and external stakeholders.

• Participate in technical discussions and provide expert guidance on signal/power integrity matters.

• Master's degree in electrical engineering, Computer Engineering, or a related field (PhD preferred)

• 10+ years of experience in SIPI or related field, In-depth knowledge of PDN design principles, including modeling, simulation, and optimization techniques.

• Expertise in advanced SI simulation tools like Cadence Sigrity, Clarity, HyperLynx, HFSS, or equivalent.

• Proven experience in leading and managing complex engineering projects

• In-depth knowledge of 3D-IC packaging technologies, including chip stacking, interposers, and through-silicon vias (TSVs)

• Proven experience with high-speed interface design and analysis (HBM, DDR, PCIe, etc.).

• Strong understanding of thermal, signal integrity, and power integrity concepts

• Excellent written and verbal communication skills.

• Ability to work effectively in a team environment.

We're doing work that matters. Help us solve what others can't.

Client-provided location(s): Bengaluru, Karnataka, India
Job ID: Cadence-R46346
Employment Type: Full Time

Perks and Benefits

  • Health and Wellness

    • Dental Insurance
    • Vision Insurance
    • Life Insurance
    • Short-Term Disability
    • Long-Term Disability
    • FSA
    • HSA With Employer Contribution
    • Fitness Subsidies
    • On-Site Gym
    • Mental Health Benefits
    • Virtual Fitness Classes
    • Health Insurance
  • Parental Benefits

    • Birth Parent or Maternity Leave
    • Non-Birth Parent or Paternity Leave
    • Fertility Benefits
    • Adoption Assistance Program
    • Family Support Resources
    • Adoption Leave
  • Work Flexibility

    • Flexible Work Hours
    • Hybrid Work Opportunities
  • Office Life and Perks

    • Casual Dress
    • On-Site Cafeteria
    • Holiday Events
  • Vacation and Time Off

    • Paid Vacation
    • Unlimited Paid Time Off
    • Paid Holidays
    • Personal/Sick Days
    • Leave of Absence
    • Volunteer Time Off
  • Financial and Retirement

    • 401(K) With Company Matching
    • Stock Purchase Program
    • Performance Bonus
    • Financial Counseling
  • Professional Development

    • Tuition Reimbursement
    • Promote From Within
    • Mentor Program
    • Access to Online Courses
    • Internship Program
    • Leadership Training Program