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The Advanced Packaging Development Center (APDC) is a state-of-the-art cleanroom that is among the most advanced wafer-level packaging labs in the world. It houses the industry's broadest portfolio of products that enable the foundational building blocks of heterogeneous integration, including advanced bump and micro-bump, fine-line redistribution layer (RDL), TSV and hybrid bonding. APDC was established as a joint lab partnership with the Institute of Microelectronics (IME), a research institute of Singapore's Agency for Science, Technology and Research (A*STAR).
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We are currently seeking for an experienced and passionate Plasma Technology Development Process Engineer to join APDC now. Apply now if you fit the description below!
Key Responsibilities
- Improve current generation plasma activation technology for hybrid bonding and develop next generation plasma technology and process
- Design and execute experiments to study various types of plasma and their processes to understand their interaction with bonding surfaces. Analyze data to identify the key and common factor(s) of plasma that contributes to the strongest activation for hybrid bonding.
- Optimize process and/ or drive CIP to improve current generation plasma chamber. Identify the most suitable plasma technology and conduct CnF test to define requirements for next generation chamber.
- Deep dive with engineering team to prototype next gen chamber based on defined requirements. Evaluate proto chamber for hybrid bonding process and drive engineering optimization.
- Plasma technology & process subject-matter expect to guide account/field teams on tough plasma technical issues.
Functional Knowledge
- Good understanding of plasma physics and processes is essential.
- Practical background on any types of plasma technology and its characterization is needed.
- Familiar with common plasma characterization tools (such as OES, ion sensor, RGA, thickness measurement etc.) and methodology.
- Knowhow to analyze surface characterization results (XPS, TEM, phase analysis, SIMS, EELS, etc) is a strong plus.
- Any backgrounds of WoW or CoW bonding is a bonus.
Opportunities
- On-job training on CoW hybrid bonding processes and challenges. Hands-on on the state-of-the-art integrated hybrid bonder to witness and contribute to the historical industrial inflection from micro-bump to hybrid bonding.
- Opportunity of oversea training by/ interaction with engineering team/ plasma experts if needed
- Technical training on/ exposure to up & downstream integration processes and interaction with hybrid bonding
Requirements
- Engineering or science university educational background.
- > 5 years experiences on plasma technology. Background on plasma development is strongly preferred.
- 10% travel commitment to the US (California), Taiwan, Korea or Europe
Working Location
- Science Park II, Singapore (Moving to Tampines in 2026
Qualifications
Education:
Bachelor's Degree
Skills
Certifications:
Languages:
Years of Experience:
4 - 7 Years
Work Experience:
Additional Information
Shift:
Day (Singapore)
Travel:
Relocation Eligible:
No
Referral Payment Plan:
None
Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.