Who We Are
Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world - like AI and IoT. If you want to work beyond the cutting-edge, continuously pushing the boundaries of science and engineering to make possible the next generations of technology, join us to Make Possible® a Better Future.
What We Offer
Location:
Singapore,SGP
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At Applied, we prioritize the well-being of you and your family and encourage you to bring your best self to work. Your happiness, health, and resiliency are at the core of our benefits and wellness programs. Our robust total rewards package makes it easier to take care of your whole self and your whole family. We're committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.
You'll also benefit from a supportive work culture that encourages you to learn, develop and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible-while learning every day in a supportive leading global company. Visit our Careers website to learn more about careers at Applied.
Be part of an exciting team working on cutting-edge advanced packaging process technologies. Participate in process development and integration solution to enable advanced packaging process technologies in the world of mobile, IoT, consumer and high-performance computing area. Partner and work with various teams from inside and outside of Applied Materials to help develop leading-edge packaging solutions for our customers, taking the solutions from concept to mass production. Responsibilities will include assisting in execution of process integration in clean room to make sure projects are completed successfully and delivered on time.
Responsibilities:
- Assisting engineer to work on developing assembly process technologies for advanced System-in-Package, RDL, Hybrid Bonding and Heterogeneous Packaging solutions
- Responsible for assisting in developing advanced 2.5D and 3D SiP MEOL and assembly flows
- Owner for execution of module process, data collection for measurement & inspection to validate each process in integration
- Interact with internal and external module process owners to align for tool time, execute process sequence and collect data to feedback to integration owner
- Occasional over-time to support process engineering activities
Requirements:
- ITE/ Diploma in Engineering or relevant studies
- Basic understanding on semiconductor process is preferred
- Experience on MEOL & Packaging Assembly unit Process (Reconstitution, Litho, Etch, CVD, PVD, Plating, Back Grinding, Dicing, Molding, P&P, Wire Bonding etc.) will be added advantages
- Candidates with minimum experiences are welcome to apply
Additional Information
Time Type:
Full time
Employee Type:
Assignee / Regular
Travel:
No
Relocation Eligible:
No
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.