Who We Are
Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world - like AI and IoT. If you want to work beyond the cutting-edge, continuously pushing the boundaries of science and engineering to make possible the next generations of technology, join us to Make Possible® a Better Future.
What We Offer
Location:
Tainan,TWN
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At Applied, we prioritize the well-being of you and your family and encourage you to bring your best self to work. Your happiness, health, and resiliency are at the core of our benefits and wellness programs. Our robust total rewards package makes it easier to take care of your whole self and your whole family. We're committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.
You'll also benefit from a supportive work culture that encourages you to learn, develop and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible-while learning every day in a supportive leading global company. Visit our Careers website to learn more about careers at Applied.
台灣應用材料暑期實習專案
申請資格:大學就學三年以上的在學學生(含碩、博士);應屆畢業生即將進入職場者請勿投遞;若需繼續升學者請附上入學證明。
申請文件 : 提供中英文履歷; 中文自傳(同步提供英文版更加分); 學校成績單; 專業認證證照或作品集。
收件期間 : 2025/2/1 - 2025/4/15 (面試若符合資格,優先給予錄取通知)。
附加條件:
1. 實習期間:2025/7/1-2025/8/31。
2. 實習期間之交通與住宿需自理。
3. 實習期間,須全程參與,若無法承諾及配合,請勿投遞。
4. 實習尾聲,須提交報告,分享實習成果,方可領取結業證書。並正式納入公司人才庫。
5. 工作待遇:大學生月薪台幣42,000元,碩士生月薪台幣48,000元,博士生月薪台幣53,000元。
Key Responsibilities
Software development based on customer design, feature release and qualification testing.
1. Design and develop feasible solutions in Klayout (free and powerful software developed for chip design engineers).
2. Support software developers to verify component functionality and reliability through laboratory tool testing.
3. Prepare software manual for feature release.
Software development
1. Modify limited, polygon sizing/biasing of the global RDL (Redistribution Layer) - Phase
2. Resize or bias RDL layers based on region or angle - Phase 2.
3. Combine Phase 1 and Phase 2 together.
Software testing
1. Understand the requirements.
2. Define the test case objective.
3. Identify test scenarios.
4. Write a descriptive test case title.
5. Set preconditions (if any)
6. List the test steps.
7. Define the test results.
Software release
1. Learn and understand software release processes and cycles.
2. Prepare functional specifications for test engineers and support engineers.
3. Plan and release new features through user manuals.
Final Review
1. The intern will present project in English (30 minutes)
Requirements
Skill: Fluent English communication/writing/presentation (TOEIC 750+)
Knowledge: Computer science, Materials science, Chemical engineering, Electrical engineering, Mechanical engineering or other relevant disciplines.
Experience: Analytical skills, research ability, Linux knowledge/experience platform, ability to learn any programming language such as Python.
Education (Major/Degree) : Computer Science, Information Science, Electrical engineering or other relevant disciplines.
Additional Information
Time Type:
Full time
Employee Type:
Intern / Student
Travel:
Not Specified
Relocation Eligible:
No
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.